Click on the competition images to go straight to the competition page, or click here for a more detailed overview at HWBOT.
World Tour 2017 and HWBOT X
Coming soon ...>
Road to Pro 2017
Starts Feb 1, 2018
|3DMark - Time Spy||Titan V||H2o vs. Ln2||16368 marks|
|GPUPI - 1B||Titan V||H2o vs. Ln2||1sec 112ms|
|3DMark Vantage - Performance||Titan V||jpmboy||120776 marks|
|3DMark - Time Spy||Titan V||jpmboy||15820 marks|
|3DMark - Time Spy||Titan V||Menthol||15706 marks|
|3DMark - Fire Strike||Titan V||Menthol||32789 marks|
|3DMark Vantage - Performance||Titan V||H2o vs. Ln2||119739 marks|
|3DMark - Fire Strike Extreme||Titan V||Menthol||18472 marks|
|3DMark11 - Performance||Titan V||jpmboy||40312 marks|
|SuperPi - 32M||Core i7 7700K||superpatodonaldo||4min 30sec 359ms|
Click on the competition images to go straight to the competition page, or click here for a more detailed overview at HWBOT.
Coming soon ...>
Starts Feb 1, 2018
The GPU Flashback Archive series continues today with a recap of the NVIDIA GeForce 700 series, a series refresh which heralds part two of the Kepler family of GPUs. We can also remember it as a time when NVIDIA launched their first ever GTX Titan card and with it, a new pricing and retail strategy for truly high-end graphics card products. Let’s take a look at the new Kepler architecture GPUs, the cards that were popular with HWBOT members and some of the more memorable scores that have been posted since launch.
The 2011-2013 period of history saw NVIDIA implement a more regular cadence to their high-end product launches and refreshes. One that saw the company launch a new GPU architecture every two years, with new product lines arriving each year. This means deriving two product lines per architecture with an improved version offered the second time out. This is what we saw with Fermi, an architecture whose potential was full realized at the second attempt. With the GeForce 700 series, which arrived proper in May 2013 with the arrival of both the GeForce GTX 780 and GTX 770, we have something different. The new cards arrived using a much bigger version of the Kepler architecture compared to what we saw on the NVIDIA 600 series.
The GPU Flashback Archive arrives today at the NVIDIA 600 series that debuted in Spring of 2012. The new range of cards showcased a new graphics architecture design and the beginning of what we might describe as the Kepler era. Let’s take a peek at the changes that the new design heralded as well as a close up view of on the GeForce GTX 680 card, the most popular 6-series card with HWBOT members historically speaking. Before we look at some notable scores that were made with the GeForce 680, let’s first kick off with an overview of what innovations arrived with the new Kepler architecture.
If we cast our minds back to 2012 we can recall a era when NVIDIA and AMD were virtually neck and neck, with successive graphic card launches from each company swinging the performance crown from side to side. The arrival of Kepler in many ways represents the beginning of the end of the competitive duopoly that is clearly absent today. Kepler helped NVIDIA push ahead of AMD in terms of graphics processor design, creating a performance lead which AMD still finds insurmountable, despite the arrival of their latest Vega-based cards. Let’s take a look at Kepler in a little detail.
This week the GPU Flashback Archive sets its sights on the GeForce 500 series from NVIDIA. Arriving in late 2010, the 500 Series was the second round of graphics cards based on the Fermi architecture which had limped over the line in the previous generation, ostensibly due to fabrication and yield issues. The new flagship GTX 580 arrived with a more polished take on the Fermi design that help NVIDIA combat the threat from AMD and their popular Radeon 5000 and 6000 series cards. As ever, let’s take a look at the new GPU, the new flagship card and a few of the outstanding scores that have been submitted to HWBOT.
To say that the NVIDIA 400 series graphics cards launch was less than smooth, would be a total understatement. The GF100 Fermi architecture GPU in fact arrived six months late with a significant number of cores hacked off. Blame was laid at the door of fabricators TSMC and a 40nm manufacturing process that clearly hadn’t been optimally adapted for NVIDIA’s Fermi, a monster chip boasting 3 billion transistors and a 529mm² die. While cards such as the GTX 480 had actually done well to make NVIDIA competitive in performance terms, the GTX 580 and its GF110 GPU was rather quickly shoved out the door just eight months later as a revised and improved version of the original.
This week in our GPU Flashback Archive series we cast our minds back to a very popular and well loved graphics card series, the GeForce 400 series. NVIDIA launched the GeForce 400 series in March 2010 armed with a new Fermi architecture that it hoped would help it compete with the successful AMD Radeon 5000 series. Let’s look at the new features that Fermi offered, the cards that were popular and the scores that were submitted to HWBOT in this era.
Compared to previous product launches from NVIDIA, the GeForce 400 series launch did not go as smoothly as hoped. September 2009 saw AMD come out with their Radeon 5000 series which made a solid case against NVIDIA 200 series offerings. It would be January before NVIDIA really started wooing tech media with tales of its forthcoming Fermi architecture lineup. It would be March 2010 before tech media actually got their hands on the new cards and several weeks after that before enthusiasts would be able to actually buy one. This was not the typical NVIDIA launch. Reasons for the delay certainly seemed to lie with issues with actual fabrication at TSMC who were not providing the yields expected on their new 40nm process. This was a problem that particularly hurt NVIDIA due to the fact that the new Fermi GPU, the GF100, was actually very large. When the GeForce 400 series finally arrived in the form of the GeForce GTX 480 and GTX 470, by most calculations they were six months late.
We are treated this week to a look at the NVIDIA 200 series of graphics cards. As well as rejigged product nomenclature, the 200 series represents a new and improved architectural approach to the GPU design from NVIDIA who managed to come up with their largest graphics chip ever. The 200 series was the latest weapon in the fight against ATI and one that proved to be fairly potent in terms of raw frame-rates. Let’s take a look at the new architecture, the graphics cards that were popular at the time with overclockers on HWBOT and of course, some of the more notable scores that have been made its introduction.
We mentioned in the previous GeForce 9 series article how this period of history shows plenty of overlap in terms of GPU series. In April 2008 NVIDIA launched the 9 series and the G92 GPU (read all about the 9 series here ) which was based on an improved but largely identical Tesla design. The 9 series served a purpose by bringing to market cheaper high-end enthusiast cards that could compete with ATI. It also eventually gave NVIDIA a chance to test out the 55nm manufacturing process from TSMC using a more familiar architecture. The GeForce 200 series initially launched on 65nm silicon with later revisions taking advantage the 55nm process.
Last weekend saw the very last stop of the HWBOT World Tour 2017, landing in Berlin, Germany for the Overclocking World Championship Final 2017. The Final invited nine of the world’s best extreme overclockers to compete for cash prizes and the right to be World Champion 2017. Today we bring you the entire photo album of the event which if nothing else, reveals the fact that everybody had a really good time. Thanks to OverClocking-TV for the pics. Enjoy!
HWBOT OC World Championship Final: December 9th-10th, 2017
The HWBOT World Tour 2017 visited ten countries around the world this year. At each stop an Overclocking World Championship Qualifier contest was held, an extreme overclocking contest where the region’s most talented overclockers went head to head to compete for a seat in the Final. Here are some shots of the guys as they are prepped by HWBOT contest organizers and generally getting to know each other, plus shots of the trophies that were lined up for the winners.
Last week saw the very last stop of the HWBOT World Tour
You can find the full photo album with some very interesting shots of the happenings at CaseKing HQ in Berlin here on the HWBOT World Tour site. You can also find our full report of the contest here in Part 1, and Part 2 of the OCWC 2017 Final roundup series.
Last week we covered a video from Roman ‘der8auer’ Hartung where he started his mission to actually get to the die of a $2,000 USD Intel Core i9 7980XE processor. Don’t worry, he wasn’t attacking a new and functional chip. It was actually a broken one that someone passed on to him with the sole purpose of destroying it in order to retrieve the actual die. He returned yesterday with Part II of the video.
So just to recap. First he delidded the CPU using a specialized Skylake-X version of the Delid-Die Mate tool. He then cleaned up the chip, removing the liquid metal with acetone. Going outside to avoid breathing moxious fumes, Roman then heated the chip up to temperatures beyond 450 degrees Celsius. This allowed him to actually remove the die from the silicon package, an job that proved to be rather difficult due to the underfill layer of the chip which will not budge unless you get it really hot. Eventually Roman plans to do an examination of the die itself using a USB microscope which is capable of 220x zooming and image polarization.
Before that however he wants to remove the copper layer that remains on the chip. To this submerges the chip in 40% iron(III) chloride (or ferric chloride if you prefer) using an ultra sonic cleaner with temperature control functionality. This ensures that the iron (III) chloride is in the correct temperature range. After around two hours, you can see how the copper layer is starting to wear away, revealing some the die structure beneath.
What you end up with after all this work, is the actual die of the CPU can be seen, although you have to zoom in and look at it in the right light. The next step is to use glass etching paste, a similar process to that used above, just more a bit more dangerous. Not surprising as it contains hydrofluoric acid. After ten minutes or so, the CPU die is fully recovered, and looking pretty cool (as in the photo above). It’s fascinating to see the various parts of the CPU actually revealed on the die.
You can watch the video for yourself, here on the der8aeur YouTube Channel.
It must have been around 2013 when smartphones, particularly ones using Google’s Android OS, really came of age, becoming almost totally ubiquitous. It is also around this time that it became relatively simple to adjust the settings of your handheld device to make it go a little faster, and of course there were benchmarks around where you could test and compare your performance. Yep… I refer to the advent of Mobile Overclocking, the topic of a post written in December of 2013 by our very own Pieter-Jan 'Massman' Plaisier. Here are just some of the thoughts expressed. Thoughts which ultimately led to the development of the Mobile HWBOT Prime benchmark and the integration of Mobile Overclocking with HWBOT.
The idea is simple. As a community, overclockers have been able to force hardware manufacturers to care about the product quality. Through overclocking – how irrelevant the benchmark scores may be – and the competitive nature of the overclockers, we motivated marketing teams primarily, and engineering teams secondarily, to look at how to improve the design of their product. The companies wanted not only to prevent the power users from spreading the word on poor design, but also to win the race to feature in the world record system. The result we know: better bios, better hardware, more tuning, and better design. A win for everyone!
This eco-system does not exist for mobile devices. There are tons of applications for mobile architectures outside the space of smartphones and tablets to be uncovered. We cannot let poor hardware design stop us. Let’s kick-start the eco-system! The proposed trajectory is as follows. First we introduce the competitive spirit through a benchmark application. The open-source Android version of HWBOT Prime seems to be a good start. The hope is that through rankings and leader boards, developers get interested. Who can build the fastest ROM? Who can build the most overclockable kernel? We hope that in the Hackerspace we can find a couple of people who can help work on a specific device project. For us, it will be one of the Hardkernel Odroid devices. Mainly because we have a bunch of them, and they are easy/easier to work with that smartphones or tablets. Especially when it comes to experimenting with different types of cooling.
You can read the full piece from December 10th 2013 here, which also talks about the Taipei Hackerspace.
Having covered Part 1 of the Overclocking World Championship Final 2017 contest, we now turn our attention to Part 2 and the Elimination Phase of the contest.
Day 2: 1v1 Elimination Phase - The second phase of the contest is a little more complex than usual as it uses an elimination, nine player format that ultimately means it is possible to lose a few 1v1 matches and still go on win the contest. The rankings from the previous day dictate when each contestant will participate and how many matches they will eventually have to compete in. 8th and 9th ranked players from the Qualification Phase start first, meaning they may in theory have to win more 1v1 matches than the other contenders to make it through to the decisive and final Match 16.
To make things a little more interesting, we’ll cover the contest from the experience and perspective of each individual overclocker, taking a look at the matches they competed in and the resulting outcomes. Remember, to better understand the flow of the contest, you can refer to the completed brackets by scrolling down to the bottom of this page. Let’s start with jordan.hyde99, Australia’s one big hope!.
jordan.hyde99 (Australia) - Jordan arrived at the contest as arguably the undisputed newcomer to Elite level competitive overclocking. For more info about Jordan, read the jordan.hyde99 bio in this profile article we did in the leadup to the contest. His performance in the Qualification Phase placed him at the foot of the table, meaning he faced PXHX in the first match of the contest in Round 1. This ended in a loss as he failed to make a valid score in the XH265 4K benchmark, while the Brazilian managed a score of 14fps. Perhaps the fairly long benchmark run involved with the 4K preset presented a problem for Jordan. Time management might well have been an issue here.
Read Part 2 of the OCWC 2017 Final roundup article in fullhere on OC-ESPORTS.
Just under a week ago NVIDIA launched its new Volta architecture graphics cards series, surprising a few onlookers by launching a $3,000 USD GeForce GTX Titan V that uses a ‘Big Volta’ GV100 GPU. So far a few HWBOT members have stumped up the asking price and started benching with the new latest and greatest from NVIDIA. Let’s take a look at handful of score submissions which include one World Record and 4 Global First Place, single card scores.
H2o vs. Ln2 (US) Breaks Catzilla 720p World Record - The original Mr Slinky, H2o vs. Ln2 from the US has acquired at least a few cards and has already broken his first World Record. The new VRMark Cyan Room World Record stands at 14,806 marks and was made with an NVIDIA Titan V at (apparently) stock settings, i.e. the GPU with a boost frequency of 1,455MHz and graphics memory at 850MHz. The rig also used an Intel Core i9 7980XE 'Skylake-X' chip, which puts the price of the rig's two key components at a tidy $5,000 USD alone.
H2o vs. Ln2 has clearly also been experimenting with his monster liquid cooled rig, pushing both GPU and CPU to break a few Global First Place scores. In the Unigine Superposition - 1080P Xtreme benchmark, the new fastest ever score with a single GPU now stands at 10,446 points. This was made with the Volta-architecture GPU pushed (according to the submission post) to 2,010MHz with memory at 2,132MHz. The CPU was also apparently pushed to apparently to 5.5GHz. The same rig also broke the Global First Place score for a single card in GPUPI - 1B, which now stands at 4sec 65ms.
jpmboy (US) Breaks 3DMark Time Spy and Time Spy Extreme GFP Scores - US Overclocker jpmboy has also been enjoying some Titan V performance breaking the 3DMark Time Spy Global First place record for a single card with a score of 15,570 marks. He pushed his GV100 GPU to 1,546MHz with graphics memory at 1,455MHz (+71.18%), also using an Intel Core i9 7980XE 'Skylake-X' pushed in this case to 4,900MHz. In the 3DMark Time Spy Extreme benchmark the new GFP score for a single card now stands at 8,180 marks.
NVIDIA’s new Volta GPUs certainly appear to offer a new level of performance compared to Pascal. It will be interesting to see how the GeForce GTX 2080 card performs when (if?) it arrives. Until then you can find all the new Volta scores in the links above. Enjoy.
Here’s a quick newsflash to let you know about some improvements and bugs fixes that have now been applied to the 3DMark benchmark suite from Futuremark. The relatively minor update has no affect on benchmark scores but does fix issues related to the Vulkan API Overhead feature, Custom Run looping and several other features. Here’s the rundown of the fixes applied to v2.4.4163:
Today we can bring you a full and detailed account of what happened in Berlin last weekend at the Overclocking World Championship Final were Italy’s leading overclocker rsannino took the crown and the $1,500 USD winners prize money. Let’s take a look at the contest scoring, the winners, the losers and the more interesting 1v1 matches that took place within a nine player elimination tournament.
HWBOT OC World Championship Final: December 9th-10th, 2017
The HWBOT World Tour 2017 visited ten countries around the world this year. At each stop an Overclocking World Championship Qualifier contest was held, an extreme overclocking contest where the region's most talented overclockers went head to head to compete for a seat in the Final. Here’s the general schedule for the Final which spannd two days:
OCWC 2017 Final Contestants
At the end of the year we find nine Overclockers were invited to Berlin, Germany for the OCWC 2017 Final having each qualified at different Qualifier contest. The list below shows their HWBOT member nickname, country of origin and the contest through which they qualified for the Final:
Read Part 1of the OCWC 2017 Final roundup article here on OC-ESPORTS.
The latest podcast from Hardware Asylum is now available. Episode 82 sees Dennis and Darren examine the Rockitcool 99 Deliding tool while also tackling the topic of Watercooling Upgrades. Here are the show notes:
RockitCool Rockit 99 Delidding Tool - By now many enthusiasts are familiar with delidding, or the act of removing the Intel heatspreader to replace the factory thermal paste for better thermals. This is something we have talked about in episode 72 of the Hardware Asylum Podcast where we explored the process of delidding a Kaby Lake 7700K and how beneficial it was. With the launch of the Intel X-Series processors the concept of delidding is making a comeback. You wouldn’t think a $1000 USD processor would or “should” require delidding but, if you want to get the most from your processor and prevent throttling then you’ll need to delid.
In this segment Dennis goes over the process of delidding while describing the new RockitCool Rockit 99 delidding tool designed specifically for the Intel X-Series processors including the Intel Core i7 7740X and Core i9 7900X. The new tool is very similar to the Rockit 88 with a slightly improved design to address some issues they noticed. The end result is a tool designed to safely remove and reassemble the HEDT X-Series processors designed for the Intel X299 platform.
Addressing Watercooling Deficiencies - We have all seen watercooling builds. Some are done as show pieces while others are 100% functional and of them there are usually issues that people fail to address. When Dennis set out to build the View X31 casemod there were two major modifications. The first was the custom Pearl White paint job and the other was to address cooling. The front bezel on the View 31 didn’t breathe very well so he swapped on the front panel from the Core X31 and called it good. This is also the premise behind the View X31 name.
The View X31 mod was assembled rather quickly so we could take it to the Boise LAN 6.0 and as a result helped to expose some of the cooling deficiencies and in this segment the duo talk about what went wrong and how they decided to fix it.
Catch episode 82 of the Hardware Asylum podcast here.
It’s official. After an entire year of overclocking contests throughout a busy year, visiting ten countries around the globe, we finally have a new Overclocking World Champion – the one and only rsannino from Italy. The contest featured some the world’s most feared extreme overclockers with rsannino (Italy) competing alongside steponz (US), PXHX (Brazil), Dancop (Germany), Drweez (S. Africa), BlueFiber (Indonesia), Wizerty (France), Lucky_n00b (Indonesia) and jordan.hyde99 (Australia). All competing for the right to be crowned Overclocking World Champion 2017, walking away with a check for $1,500 USD.
The contest was held at the Caseking HQ in Berlin, Germany over the weekend. Saturday was all about competing across five stages and benchmarks using the latest Coffee Lake architecture Core i7 7800K chips. After a full day of overclocking Wizerty was just ahead of rsannino on the score card, offering them both a less heavy day in Sunday’s 1v1 matches. After beating steponz (US) in the 8th and final round of the 1v1 match series, rsannino pulled out a 3DMark01 score of 661.7 marks, beating steponz on 568.6 marks to win the Championship. Congrats to you Roberto! The final standings in the contest are as follows:
You can find the scoring and submissions from Day 1 of the contest here on OC-ESPORTS. We will also be following up with more coverage of the contest, including a more in-depth review of the all action, and plenty of photos too. Until then, congrats to all the guys who clearly had a really good time in Berlin.
We are delighted today to announce the second ever season of the Cheapaz Chips contest series on OC-ESPORTS. As you may recall the idea of the contest is to encourage overclockers to put all of their ingenuity and passion into overclocking entry-level hardware that we wouldn’t cry over too much if it got bricked. Cheapaz Chips Season 2 will run through what remains of 2017, ending on January 15th. It features three stages suited to benching NVIDIA GT 1030 graphics cards, the subject matter of season 2. As an added incentive, GALAX are also offering a GALAX GTX 1080 Ti HoF OC Lab Edition card for the eventual contest winner.
Cheapaz Chips Season 2: December 15th - January 31st 2018
The Cheapaz Chips Season 2 contest on OC-ESPORTS features a very simple format based around Pascal-architecture NVIDIA GT 1030 cards. Each of the three separate stages is a specific benchmark challenge:
Note that contestants may use any processor platform, with CPUs limited to 5GHz to make the contest more GPU-centric.
The benchmarks selected for each stage pretty much reflect the standard for hardware being used - i.e. they are either legacy or low-level benchmarks. This is keeping with the spirit of the contest which takes overclocking away the from heady echelons of Extreme benching, instead bringing it all down to pure creativity and ingenuity, with zero financial barriers to entry or success. Overclockers who succeed in this contest will of course have to find a way of pushing their GT 1030 card as hard as possible, while also experimenting on CPU and memory component choices and configurations.
You can read the full Cheapaz Chips Season 2 announcement here on OC-ESPORTS.